Study of Pressure Balance for Press-Pack IGBTs and Its Influence on Temperature Distribution

Chinese Journal of Electrical Engineering ›› 2018, Vol. 4 ›› Issue (4): 57-63.

Previous Articles Next Articles

Study of Pressure Balance for Press-Pack IGBTs and Its Influence on Temperature Distribution

Zihao Zhao^1,2, Lin Liang^1,*, Lubin Han¹

1. State Key Laboratory of Advanced Electromagnetic Engineering and Technology, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, China;
2. School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China

Online:2018-12-25 Published:2019-10-31
Contact: *Email: lianglin@hust.edu.cn.
About author:Zihao Zhao received the B.S. degree in Optical and Electrical Information Engineering from Huazhong University of Science and Technology, Wuhan, China, in 2016. He is currently working towards the M.S. degree in Software Engineering at Huazhong University of Science and Technology. His research interests include modeling and packaging for power electronic modules. Lin Liang received the B.S and PhD degrees in Electronic Science and Technology from Huazhong University of Science and Technology, Wuhan, China, in 2003 and 2008 respectively. She has been the Associate Professor at Huazhong University of Science and Technology since 2011. She has been the Visiting professor at FREEDM System Center in North Carolina State University from 2014 to 2015. Her research spans modeling, optimization, process, packaging and application of power semiconductor devices. Lubin Han received the B.S. degree in Electrical Engineering and Automation from China University of Petroleum, Qingdao, China, in 2017. He is currently working towards the Ph.D. degree in Electrical Engineering at Huazhong University of Science and Technology. His research interests include modeling, packaging and characterization for power semiconductor devices.

Abstract

Abstract: Pressure balance is a key technology for Press-Pack IGBT packaging, and is studied in this paper with its influence on the temperature distribution discussed in further when the device is turned on. By establishing the physical model of the Press-Pack IGBT device in the finite element simulation software, the influence of the internal flatness condition on the pressure balance is analyzed, and the variation of the average pressure difference with the flatness in different parallel scale of the chips is obtained. The thermal contact resistance and the electrical contact resistance parameters, which are dependent on the pressure, are then imported to perform the multi-field coupling, further investigating the effect of different pressure distributions on temperature distribution. The junction-case thermal resistance of the device with different flatness is compared experimentally. The results have demonstrated the influence of the flatness on the thermal resistance of the Press-Pack IGBT device.

Key words: Press-Pack IGBT, pressure balance, temperature distribution, thermal resistance

Zihao Zhao, Lin Liang, Lubin Han. Study of Pressure Balance for Press-Pack IGBTs and Its Influence on Temperature Distribution[J]. Chinese Journal of Electrical Engineering, 2018, 4(4): 57-63.

References

[1] Zechun Dou, Guoyou Liu,Jun Chen, “Design and key technologies of high-power press-pack IGBT device,” Electric Drive for Locomotives, vol.232, no.3, pp.1-14, Jan.2013.
[2] Franc Dugal, Evgeny Tsyplakov,Andreas Baschnagel, “IGBT press-packs for the industrial market,”Power, Conversion, Intelligen, Motion(PCIM) Europe Conference, pp.114-118, 8-10 May 2012.
[3] R. Alvarez, F. Filsecker,S. Bernet, “Characterization of a new 4.5kV press pack SPT+ IGBT for medium voltage converters,”IEEE Energy Conversion Congress & Expositin (ECCE), pp. 3954-3962, 20-24 Sep.2009.
[4] S. Gunturi, J. Assal, D. Schneider,S. Eicher, “Innovative metal system for IGBT press pack modules,”Proceedings of IEEE 15th International Symposia on Power Semiconductor Devices(ISPSD), pp. 110-113, Apr.2003.
[5] Øyvind Bjerke Frank, Power Cycle Testing of Press-Pack IGBT Chips. PhD Dissertation, Norwegian University of Science and Technology, Norway, 2014.
[6] W. Hermansson, F. Chimento,T. Jonsson, “Robustness evaluation of high voltage press pack IGBT modules in enhanced short circuit test,”IEEE Energy Conversion Congress & Exposition(ECCE), pp. 92-99, 12-16 Sep. 2010.
[7] Zhengming Zhao, Kai Li,Ye Jiang, “Overview on reliability of modular multilevel cascade converters,” Chinese Journal of Electrical Engineering, vol.1, no.1, pp. 37-49, Dec.2015.
[8] Jinlei Meng, Puqi Ning,Xuhui Wen, “A finite difference method modeling for IGBT and diode in PSPICE,” Chinese Journal of Electrical Engineering, vol.3, no.3, pp.85-93, Dec. 2017.
[9] J. Poller, T. Basler,M. Hernes, “Mechanical analysis of press-pack IGBTs,” Microelectronics Reliability, vol.52, no.9, pp. 2397-2402, Jun.2012.
[10] J. Poller, S. D’Arco,M. Hernes, “Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs,” Microelectronics Reliability, vol.53, no.9, pp.1755-1759, Nov.2013.
[11] T. Poller,J. Lutz, “Determination of the thermal and electrical contact resistance in press-pack IGBTs,” IEEE 15th European Conference on Power Electronics and Applications, vol.32, no.13, pp.1233-1241, 2-6 Sep. 2013.
[12] A. A. Hasmasan, C. Busca,R. Teodorescu, “Electro-thermomechanical analysis of high-power press-pack insulated gate bipolar transistors under various mechanical clamping conditions,” IEEE Journal of Industry Applications, vol.3, no.3, pp. 192-197, Oct.2014.
[13] E. Deng, Z. Zhao,P. Zhang, “Clamping force distribution within press pack IGBTs,” Transactions of Electrotechnical Society, vol.32, no.6, pp. 201-208, Mar.2017.
[14] E. Deng, Z. Zhao,P. Zhang, “Optimization of the thermal contact resistance within press-pack IGBTs,” Microelectronics Reliability, vol.69, no.1, pp. 17-28, Feb.2017.
[15] Philip Bill, Adriaan Welleman,Esie Ramezani, “Novel presspack IGBT device and switch assembly for pulse modulators,” IEEE 18th Pulsed Power Conference, Chicago, 18-22 June 2011.
[16] F. Wakeman, G. Lockwood,M. Davies, “Pressure contact IGBT, the ideal switch for high power applications,” IEEE 34th Industry Applications Society Annual Meeting, vol.1, no.44, pp. 700-707, 3-7 Oct.1999.
[17] Rodrigo Alvarez, Felipe Filsecker,Martin Buschendorf, “Characterization of 4.5kV/2.4kA press pack IGBT including comparison with IGCT,”IEEE Energy Conversion Congress and Exposition(ECCE), pp. 260-267, 15-19 Sep. 2013.
[18] H. Matsuda, N. Kawamura,M. Hiyoshi, “A highly reliable press packed IGBT,” Electrical Engineering Japan (English Transl. Denki Gakkai Ronbunshi), vol. 131, no. 1, pp. 78-85, Jan.2000.
[19] Hongxiu Xiao, Zechun Dou,Yongdian Peng, “Thermal design and simulation of high power press-pack IGBT module,” High Power Converter Technology, no.6, pp. 24-30, Dec.2016.
[20] Y. Takahashi, K. Yoshikawa,M. Soutome, “2.5kV-1000 a power pack IGBT (high power flat-packaged NPT type RCIGBT),” IEEE Transactions on Electronic Devices, vol. 46, no. 1, pp. 245-250, Jan.1999.
[21] C. Busca, Teodorescur, and F. Blaabjerg, “Dynamic thermal modelling and analysis of press-pack IGBTs both at componentlevel and chip-level,”Proceedings of the 39th Annual Conference of the IEEE Industrial Electronics Society(IECON), pp.677-682, Vienna, Austria, 10-13 Nov. 2013.
[22] F. Wakeman, D. Hemmings,W. Findlay, “Pressure contact IGBT, testing for reliability,”IEEE Trans Speech Audio Process, pp. 34-38, Sep.2000.
[23] Y. Hyodo, T. Hatakeyama,R. Kibushi, “Measurement of thermal and electrical contact resistance between conductive materials,”IEEE International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), pp. 132-135, 12-21 Apr.2018.

Study of Pressure Balance for Press-Pack IGBTs and Its Influence on Temperature Distribution

PDF

Knowledge

Abstract

Cite this article

share this article

References

Related Articles 15

Recommended Articles

Metrics

Comments

[1]	LI Yuanbo, YANG Tao, ZHENG Shaoxian, ZHAO Xilong. Electrostatic Probe Differential Analysis for Temperature Distribution Diagnostics of Constricted Arc Current-carrying Region in Sheet Slanting Tungsten Electrode with Insulating Solid Wall [J]. Journal of Mechanical Engineering, 2019, 55(4): 60-66.
[2]	LI Hongchuan, JI Xianbing, ZHENG Xiaohuan, YANG Wolong, XU Jinliang. Study on Heat Transfer Properties of Flat Heat Pipe with Conical Capillary Wicks [J]. Journal of Mechanical Engineering, 2015, 51(24): 132-138.
[3]	SU Gaohui; YANG Zichun; SUN Fengrui. Molecular Dynamics Simulation of Thermal Conductivity of Primary Particle of Silica Aerogel [J]. , 2014, 50(22): 178-185.
[4]	SHAO Chengjun;LI Xiuliang;SU Hongye. Intelligent Control for Earth Pressure in Chamber of Earth Pressure Balance Shield Machine Based on Multi-system Coordination [J]. , 2014, 50(21): 105-110.
[5]	QIAO Tieliang;CUI Xiaoyu;HAN Hua;LI Zhihua. Research of the Heat-transfer Performance on Methanol/Acetone Oscillating Heat Pipe [J]. , 2014, 50(18): 155-161.
[6]	DENG Jiadong;HUA Lin;QIAN Dongsheng. Genetic Influences of Blank Temperature Distribution on Radial-axial Ring Rolling Deformation [J]. , 2014, 50(14): 110-117.
[7]	HAO Xiaohong;HU Zhengguang;HOU Qiong;FANG Ying;LI Xuekang;PENG Bei. Optimization of Serpentine Channel Heat Sink Based on Multi-objective Genetic Algorithm [J]. , 2013, 49(10): 151-155.
[8]	LI Peng;DUAN Baoyan;ZHENG Fei;ZHOU Shenghuai. Electromechanical Coupling Analysis of Ground Reflector Antennas in Clear-day Environment [J]. , 2012, 48(4): 136-145.
[9]	GUO Wei;HU Jing;WANG Lei;LIU Jianqin. Study on the Opening Distribution Characteristics of Earth Pressure Balance Shield Cutter Head Based on CFD [J]. , 2012, 48(17): 144-151.
[10]	REN Subo;BAI Minghua. Hot Deformation and Error Analysis of Sprocket Wheel Tooth Profile for Even Tooth Sintering Machine [J]. , 2011, 47(22): 55-60.
[11]	WANG Yanshuang;LIU Zhe;ZHU Haifeng. Temperature Field Analysis of Bearing with Shaft [J]. , 2011, 47(17): 84-91.
[12]	LIU Xuanyu;SHAO Cheng. Present Status and Prospect of Shield Machine Automatic Control Technology [J]. , 2010, 46(20): 152-160.
[13]	ZHANG Shijun;LIU Zhanqiang;LIU Jigan. Calculating Transient Temperature Distribution of Single-coated Tool in High Speed Cutting [J]. , 2010, 46(1): 187-193.
[14]	WANG Yong;LIU Zhengshi;CHEN Enwei;LU Yimin;GE Yunjian. Mechanical Characteristic and Design Principle of Underwater Force Sensor Based on Pressure Balance of Bladder [J]. , 2009, 45(10): 15-21.
[15]	ZHOU Shaowei;JIANG Renqiu;CHEN Yuejin;SONG Fuyuan;WANG Pengtao;ZHANG Peng;GAO Chao. Experimental Investigations of Temperature Distributions in a Vortex Tube [J]. , 2008, 44(1): 227-232.