Review of Hybrid Packaging Methods for Power Modules*

doi:10.23919/CJEE.2023.000040

Chinese Journal of Electrical Engineering ›› 2023, Vol. 9 ›› Issue (4): 23-40.doi: 10.23919/CJEE.2023.000040

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Review of Hybrid Packaging Methods for Power Modules^*

Puqi Ning^1,2,*, Xiaoshuang Hui^1,2, Yuhui Kang^1,2, Tao Fan^1,2, Kai Wang¹, Yunhui Mei³, Guangyin Lei⁴

1. Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China;
2. University of Chinese Academy of Sciences, Beijing 100049, China;
3. School of Electrical Engineering, Tiangong University, Tianjin 300387, China;
4. Academy for Engineering and Technology, Fudan University, Shanghai 200433, China

Received:2023-07-12 Revised:2023-08-14 Accepted:2023-10-18 Published:2024-01-08
Contact: *E-mail: npq@mail.iee.ac.cn
About author:Puqi Ning received his Ph.D. degree in Electrical Engineering from the Virginia Polytechnic Institute and State University, Blacksburg, VA, USA, in 2010. He is presently working as a Full Professor at the Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China. His current research interests include high temperature packaging and high-density converter designs.
Xiaoshuang Hui received the B.S. degree in Electrical Engineering in 2021 from Civil Aviation University of China, Tianjin, China. He is currently pursuing the Ph.D. degree in the Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China. His current research interests include design and testing of power modules, and integrated optimization of high power density motor drive systems.
Yuhui Kang received a B.S. degree in Electrical Engineering and Automatization Specialty from Shijiazhuang Tiedao University, Hebei, China, in 2015. She also received an M.S. degree from the Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China in 2019. Her research interests are in packaging technology of power electronic devices.
Tao Fan received the B.S. degree in Electrical Engineering from Tsinghua University, Beijing, China, in 2004, and the M.S. and Ph.D. degrees in Electrical Engineering from the Graduate University of the Chinese Academy of Sciences, Beijing, in 2006 and 2009, respectively. From 2009 to 2011, he worked as an Assistant Professor with the Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, where he became an Associate Professor in 2011 and a Professor in 2017. His research interests include design and analysis of special electrical machine, large power generation, and high-power electrical propulsion system.
Kai Wang received his Ph.D. degree in the National Center for Nanoscience and Technology, Beijing, China, in 2012. From 2012 to 2014, he worked as a Postdoctoral Fellow at Singapore-MIT Alliance for Research and Technology, Singapore. He is presently working as an Associate Professor at the Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing, China. His current research interests include new energy storage prototype device.
Yunhui Mei (Senior Member, IEEE) is currently a Professor with the School of Electrical Engineering, Tiangong University, Tianjin, China. From 2011 to 2020, he was a Professor with the School of Material Science and Engineering, Tianjin University. He was with the Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA. He has authored more than 130 papers and 25 granted patents on power electronic packaging. His current research interests include power packaging, materials, and reliability for high power-density and high temperature applications.
Guangyin Lei received his Ph.D in Materials Science and Engineering from Virginia Tech in 2010. From 2010 to 2018, worked as a Research and Development Engineer at Ford Motor Company in the United States. From 2018 to 2020, worked as a Technical Expert at Shanghai Future Automobile Co., Ltd. Since 2020, he has been working as a Researcher at the Engineering and Applied Technology Research Institute of Fudan University. His research interest is power semiconductor module packaging technology.

Abstract

Abstract: The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.

Key words: Junction temperature monitoring, IGBT, conduction voltage

Puqi Ning, Xiaoshuang Hui, Yuhui Kang, Tao Fan, Kai Wang, Yunhui Mei, Guangyin Lei. Review of Hybrid Packaging Methods for Power Modules^*[J]. Chinese Journal of Electrical Engineering, 2023, 9(4): 23-40.

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