[1] F C Lee, Q Li, Z Liu, et al.Application of GaN devices for 1 kW server power supply with integrated magnetics.CPSS Transactions on Power Electronics and Applications, 2016, 1(1): 3-12. [2] L Huber, Y Jang, M M Jovanovic.Performance evaluation of bridgeless PFC boost rectifiers.IEEE Transactions on Power Electronics, 2008, 23(3): 1381-1390. [3] P Q Ning, T S Yuan, Y H Kang, et al.Review of Si IGBT and SiC MOSFET based on hybrid switch.Chinese Journal of Electrical Engineering, 2019, 5(3): 20-29. [4] L Zhou, Y Wu, J Honea, et al.High-efficiency true bridgeless totem pole PFC based on GaN HEMT: Design challenges and cost-effective solution. Proceedings of PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2015: 1-8. [5] E Persson.How 600 V GaN transistors improve power supply efficiency and density.Power Electron. Eur., 2015(2): 21-24. [6] E Persson.Practical application of 600 V GaN HEMTs in power electronics.Proc. IEEE Appl. Power Electron. Conf. Expo.(APEC), 2015. [7] A Q Huang. Wide bandgap (WBG) power devices and their impacts on power delivery systems. 2016 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, 2016: 20.1.1-20.1.4. [8] E A Jones, F F Wang, D Costinett.Review of commercial GaN power devices and GaN-based converter design challenges.IEEE Journal of Emerging and Selected Topics in Power Electronics, 2016, 4(3): 707-719. [9] A Lidow.GaN transistors: Giving new life to Moore's Law. 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD), Hong Kong, China, 2015: 1-6. [10] A B Ponniran, K Orikawa, J Itoh.Minimum flying capacitor for N-level capacitor DC/DC boost converter.IEEE Transactions on Industry Applications, 2016, 52(4): 3255-3266. [11] B Mirafzal.Survey of fault-tolerance techniques for three-phase voltage source inverters.IEEE Transactions on Industrial Electronics, 2014, 61(10): 5192-5202. [12] P Lezana, J Pou, T A Meynard, et al.Survey on fault operation on multilevel inverters.IEEE Transactions on Industrial Electronics, 2010, 57(7): 2207-2218. [13] F Richardeau, T T L Pham. Reliability calculation of multilevel converters: Theory and applications.IEEE Transactions on Industrial Electronics, 2013, 60(10): 4225-4233. [14] Z H Fang, D Jiang, Y C Zhang.Study of the characteristics and suppression of EMI of inverter with SiC and Si devices.Chinese Journal of Electrical Engineering, 2018, 4(3): 37-46. [15] GS61004B, GaN System Datasheet. [2020-05-01].https:// gansystems.com/wp-content/uploads/2018/04/GS61004B-DS-Rev-180419.pdf. [16] EPC2104, EPC Datasheet. [2020-05-01].https://epc-co. com/ epc/Portals/0/epc/documents/datasheets/EPC2104_datasheet.pdf. [17] GS66516B, GaN System Datasheet. [2020-05-01].https:// gansystems.com/wp-content/uploads/2019/01/GS66516B-DS-Rev-190121-1.pdf. [18] GS66508T, GaN System Datasheet. [2020-05-01].https:// gansystems.com/wp-content/uploads/2019/04/GS66508T-DS-Rev-190423.pdf. [19] GS66504B, GaN System Datasheet. [2020-05-01].https:// gansystems.com/wp-content/uploads/2018/04/GS66504B-DS-Rev-180422.pdf. [20] IGO60R070D1 600V CoolGaN™ enhancement-mode Power Transistor, Infineon Datasheet. [2020-05-01].https:// www.infineon.com/dgdl/Infineon-IGO60R070D1-DS-v02_01-EN.pdf?fileId=5546d46265f064ff016685f053216514. [21] TP65H035WSQA, Transphorm Datasheet. [2020-05-01].https:// www.transphormchina.com/en/document/datasheet-tp65h 035wsqa-650v-aec-q101-gan-fet/. [22] W T Mclyman.Transformer and inductor design handbook. 3rd ed. New York: Marcel Dekker, 2004. [23] R Erickson, D Maksimovic.Fundamentals of power electronics. Holland: Kluwer Academics, 2000. [24] S B Qin, Y T Lei, I Moon, et al.A high power density power factor correction front end based on a 7-level flying capacitor multilevel converter.2016 IEEE 2nd Annual Southern Power Electronics Conference (SPEC), 2016: 1-6. |